Computing
In HPC, technological innovation is driving an increasing demand for efficient and energy-saving chips, and advanced packaging technologies are receiving growing attention. JCET delivers one-stop solutions with a full patent portfolio, comprehensive production capacity, and an evolving technology roadmap covering compute, memory, power, and connectivity.
JCET’s XDFOI® high-density multi-dimensional heterogeneous integration is in stable mass production. This multi-dimensional fan-out chiplet solution integrates package assembly and test across 2D, 2.5D, and 3D technologies, and JCET continues to expand its diverse offerings.
Product & Package Form增长分类
HPC & AI
CPU, GPU, FPGA, ASIC, …
XDFOI-O fcBGA-H
XDFOI-B fcBGA-H
Highlights
Cost-effective, comprehensive, and high-yield 2.5D solutions
Ultra High-Density Bumping
Large-scale flip chip solutions and ultra-fine pitch micro-bumping
HVM-Proven WLP Solutions
More Applications
