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Reliable semiconductor backend manufacturing solutions are crucial to the development of the automotive ecosystem. For the mainstream packaging options for in-vehicle MCUs, JCET provides cost-competitive QFP/QFN and copper wire welding BGA options. In addition, technologies such as flip-chip, system-in-package (SiP), and fan-out wafer-level packaging are all available. At present, the L/S of the mass-produced flip-chip can reach 10 microns, and the bump pitch is as small as 70 microns; the L/S of the automotive-grade mass-produced 1/2/3L RDL has reached 8 microns; the largest eWLB package product that has been verified by mass production reaches 12x12mm. 

JCET is also actively promoting the mass production applications of core materials such as ceramic substrates for new energy power module packaging (DBC/DBA/AMB), aluminum wire, aluminum tape, copper clips, DTS interconnects, and silver sintering processes.